Summary: If you have been exposed to a programmer, you will not be unfamiliar with the adapter. However, how do you choose a suitable adapter? There are many different adapter models, even the BGA153 adapter, there are several different models. Maybe you will ask what to do? Let's talk about how to choose an adapter.
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At present, eMMC chips are widely used in mobile phones, tablet computers, smart TVs, set-top boxes and other electronic products because of their fast speed, simple interface, standardization and no need for bad block management. HIS iSuppli predicts that eMMC shipments will reach 779.1 million in 2015. Behind the large usage of this day, eMMC burning is also a problem to be considered, so that the burning is stable, first of all, to make the hardware connection stable and reliable, how to choose eMMC adapter is the first consideration.
figure 1
1. What is an adapter?
The adapter is actually an interface converter that adapts chips with different packages to the same burner. In the programmer, the adapter transfers the interface of the programmer to an interface suitable for the chip. The BGA153 adapter is an eMMC chip for programming 153 ball FBGA packages, so its function is to convert the programmer interface into an FBGA package interface, as shown in Figure 2.
Figure 2 adapter
2, the type of adapter
Maybe you only care about what chips you can burn, and you don't want to know the type of adapter. However, different types play different effects in different situations. For the contact between the adapter and the chip, the adapter of the BGA package can be divided into two categories: the ball and the thimble.
The ball-fitted adapter is for the spherical array of lead chips. As shown in Figure 3, the BGA153 chip has rectangular white pins that are solder ball pins, which are equivalent to one ball attached to the chip. The structure of the ball-fitted adapter is shown in Figure 4. The two metal pieces are clips, and the black circle is the solder ball pin. Unlike the ejector pin, the two clips that are telescopic in the horizontal direction can The solder ball pins are well clamped.
Figure 3 BMM153 eMMC chip
Figure 4 clip ball contact
The thimble-type adapter is shown in Figure 5. The yellow part is the thimble, and the black part is the solder ball pin IC and the pad type pin IC. Whether it is a solder ball or a pad type IC, it has a spring up and down. The active thimbles are in good contact.
Figure 5 thimble contact
3, the comparison of the adapter
The ball and thimble-type adapters have their own advantages and disadvantages and are used in different occasions, as shown in Table 1.
4, different chip package
Even the 153BGA packaged chips have different package sizes, mainly in the area of ​​the chip. Most eMMC chip packages have a length and width of 11.5MM*13MM and a height of 0.8MM-1.0MM. The length and width of the small package is 10MM*11MM, and the height is generally 0.8MM-1.0MM. Among them, there is a package size is relatively rare, the package length and width is 11.5MM * 13.5MM, the height is generally 0.8MM-1.0MM. In addition, there is a large-size package with a length and width of 14MM*18MM and a height of 0.8MM-1.4MM.
For different packages of chips, the mating adapters will be different.
5, the choice of adapter
Depending on the type of adapter and the package of the chip, a suitable adapter can be chosen very well. The type of adapter needs to be determined according to the application and actual needs. A thimble-based adapter that can be used in contact with solder balls or pad-type chips, and has a short lifetime, which can be used for master analysis and disassembly and repeat programming; a ball-type adapter can only be in contact with a spherical pin chip. However, based on long life, it can be used for large-scale programming in factories.
For different packages of chips, there will be different adapter models corresponding to them, as shown in Table 2.
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