Comsol simulation of graphene (heat transfer, electrical, structural mechanics simulation)

COMSOL MulTIphysics is a large-scale advanced numerical simulation software developed by the Swedish company COMSOL. It is widely used in scientific research and engineering calculations in various fields. It is called “the first truly arbitrary multi-physics direct coupling analysis software” by scientists in the world. "Applicable to a variety of physical processes in the field of analog science and engineering, COMSOL MulTIphysics enables highly accurate numerical simulation of any multiphysics with efficient computational performance and outstanding multi-field direct coupling analysis capabilities. Widely used in the field.

1. Solving multi-field problems = Solving equations, users can easily implement multi-physics direct coupling analysis by simply selecting or customizing different professional partial differential equations for any combination.

2. Fully open architecture, users can easily and freely define the required professional partial differential equations in the graphical interface.

3. Solving parameters controlled by arbitrary independent functions, material properties, boundary conditions, and loads all support parameter control.

4. Professional calculation model library, built-in various common physical models, users can easily select and make necessary modifications.

5. Embedded rich CAD modeling tools, users can directly 2D and 3D modeling in software.

6. Comprehensive third-party CAD import function to support the import of current mainstream CAD software format files.

7. Powerful meshing capability, support multiple meshing, and support mobile grid function.

8. Large-scale computing capabilities with 64-bit processing power and parallel computing capabilities for Linux, Unix, and Windows systems.

9. Rich post-processing function, can output and analyze various data, curves, pictures and animations according to users' needs.

10. Professional online help documentation, users can easily grasp the operation and application of the software through the operating manual that comes with the software.

11. Multi-language operation interface, easy to learn and use, convenient and fast load conditions, boundary conditions, solution parameter setting interface.

COMSOL provides a variety of tools to help simulate geometry and features with extremely high aspect ratios. Recently, the heat transfer simulation of graphene “quilt” was carried out using COMSOL, and the study was published in “Nature CommunicaTIons” magazine “Graphite Quilt for Thermal Management of High Power GaN Transistors”. The authors using COMSOL Multiphysics have demonstrated that the local thermal management of AlGaN/GaN heterojunction field effect transistors (HEFT) can be significantly improved by introducing an additional heat dissipation via thin-layer graphene (FLG), the top thermal pad.

The heat transfer interface of COMSOL Multiphysics allows you to simulate extremely high aspect ratio components using thin layer features. This feature only solves the heat transfer equation at the surface section, thus eliminating the need to use extremely fine-grained networks in high aspect ratio layers. Using this method can greatly reduce computation time and memory usage.

Thin layer feature setting window

Since 2006, COMSOL has been used to study the electrical characteristics of graphene. In this paper, the researchers used COMSOL to derive the in-plane and lateral conductance of graphene-based composites. We can easily enter the tensor physical quantity of conductivity in COMSOL Multiphysics. You only need to provide a conductivity tensor, which can be a function of temperature or any other amount.

Anisotropic conductivity can be easily specified in the setting window of the current interface current conservation feature

COMSOL can also simulate the structural mechanics of graphene. In this paper, the researchers calculated the deflection and strain produced by the graphene film under pressure differentials. Electrical changes can be detected in the strip structure, which means it can be used to make ultra-sensitive pressure sensors. The shell interface of the structural mechanics module is mainly used for structural mechanics analysis in thin-walled structures and is therefore well suited for such applications. The shell interface uses the Mindlin-Reissner class formula, which takes into account the transverse shear deformation. This means that we can achieve high precision results without meshing very thin structures.

Setting window of the material model in the shell interface

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