In the 4G mobile communication market, the competition is intensifying. In addition to the latest LTE technology development, such as Cat. 9, three-carrier aggregation (3CCA), the processor manufacturers rely on 10 core, 2.5D package stacking, and even TSV. Unique design, creating a functional integration and cost-effective solution, set off a new round of technical warfare.
LTE and the Internet of Things have become the highlights of Computex this year. Processors including Qualcomm, MediaTek, Marvell and Intel have all released new products to match the next stage, making the next phase of the processor market more topical.
Since the introduction of the LTE data chip in 2011, Qualcomm has advanced into the latest standard design field in the 4G battlefield. In recent years, in response to MediaTek, Marvell and Intel, Qualcomm has stepped up its efforts to develop LTE Carrier Aggregation (CA) and LTE Broadcast. And new technologies such as LTE-Unlicensed. In addition, the Internet of Things is also a hot topic, attracting processor manufacturers to increase investment in research and development, is expected to detonate the next wave of technical warfare.
First attack LTE Cat. 9/3CC CA Qualcomm is close to 4G
Qualcomm teamed up with R&S, the instrument manufacturer, to showcase LTE three-carrier (3CC) CA, uplink CA, and Cat. 9 modem chip and commercial solutions, claiming that its LTE chip has been Enter the leading position of the fifth generation.
In fact, in order to improve the data download speed of user devices, 3GPP initially focused on the LTE downlink CA standard. As the mobile phone began to import MIMO antennas, 3GPP also developed the uplink CA specification in the new version of the standard, thereby increasing the speed of uploading data to the cloud. . Following the standard dynamics, Qualcomm also immediately released the Snapdragon X12 LTE modem chip supporting the uplink CA. It has recently achieved twice the TDD LTE upload speed, allowing users to share high-quality audio and video more quickly and flexibly use cloud storage space.
At the same time, Qualcomm is also the first to unveil the LTE-Advanced Cat. 9 specification and support the downlink three-carrier CA connection solution. At present, the R&S display device can achieve the TDD LTE downlink peak rate of 320 Mbit/s.
In addition to continuing to compete for the LTE processor competition threshold, Qualcomm announced on Computex this year that it will cooperate with mainland China's tablet processor developer Zhizhi, as well as operating system manufacturers - Microsoft and Google. Attack the built-in 4G Windows 10 tablet or Chromebook, and create another LTE new world.
Seshu Madhavapeddy, vice president of product management at Qualcomm Technologies, said the Windows 10 operating system is expected to stimulate the next wave of tablet market growth.
Seshu Madhavapeddy (Fig. 1), vice president of technical product management at Qualcomm, pointed out that although the recent buying power of the flat panel is not as good as expected, the product is still promising in the Chinese mainland market. Therefore, Qualcomm hopes to use the good relationship between Quanzhi and other white-listed Chinese manufacturers. Quickly enter the Chinese mainland tablet market. The cooperation between the two can further improve the price/performance ratio of the tablet, so that the tablet no longer only has the wireless local area network (Wi-Fi) connection function, and can also have the 4G LTE connection capability at the same time, stimulating the market to buy gas.
Madhavapeddy mentioned that in the past, Qualcomm and Microsoft had experience in working with mobile phones, so the mobile phone with Windows 10 is based on the Snapdragon series. At present, the cooperation between the two parties is beginning to shift to the tablet market, because Qualcomm is very optimistic about the processing power of Windows 10, and believes that the operating system will set off a wave of tablet purchases, and the combination of Snapdragon processor and Windows 10 can bring end users. Better performance, so we are working on a related layout with Microsoft, and we hope to achieve the greatest synergy.
Do not let Qualcomm specialize in the past, MediaTek as the most potential to incite its 4G status of the followers, also during the Computex one by one response to the offensive. On the eve of Computex, MediaTek unveiled a number of new LTE new processor blueprints, including eight-core plus full-mode LTE, ten-core plus full-mode LTE integrated SoCs that will be in production in the second half of this year, and will be launched in China before the end of the year. The LTE CA program, which is a major event, is expected to shorten the technology gap with Qualcomm in one fell swoop and grab about 40% of the LTE market in China this year.
MediaTek has recently actively locked in the high-end mobile phone market. During the Computex period, the Helio series' new 4G SoC--Helio P10 was added. The high-performance, high-value system single-chip solution was developed to meet the needs of smart phones. It is expected to enter mass production in the third quarter of this year, and the smart phone equipped with Helio P10 is expected to be listed at the end of this year. In addition, the company also announced that it will use “曦力†as the Chinese name for the Helio product line.
Grab the high-end mobile phone market MediaTek Helio series add new recruits
MediaTek General Manager Xie Qingjiang said that for the smart phone field, MediaTek launched a rich product portfolio, including the Helio X20, a 10-core mobile phone chip released last month, and the Helio P10 released this time, with a series of high-end chips. Meeting the challenges of global product development and transformation to meet customers' needs for mid- to high-end products and achieve a better consumer experience.
Zhu Shangzu, senior deputy general manager of MediaTek, further explained that P series products bring more design flexibility to smart phone manufacturers. The new Helio P10 is the first to use TSMC's 28nm (nm) HPC+ process, which can effectively reduce processor power consumption. Compared with the current single-chip smart phone system using the 28nm HPC process, the Helio P10 can save up to 30% of power consumption, not only in line with the lightweight and diverse multimedia experience, but also to meet battery life.
In fact, after the appearance of the Helio series at this year's World Communication Conference (MWC), MediaTek released Helio X10 and the 10-core Helio X20 Helio X series, and the Helio P10 was released at the COMPUTEX 2015. Xie Qingjiang pointed out that the Helio X20 is the world's first ten-core chip designed for the flagship smart phone, while the Helio P10 is an eight-core cost-effective solution. Both chips contain 4G mobile communication functions and top-level multimedia processing technology. .
The Helio P10 chip is built with a true 8-core 64-bit Cortex-A53 processor running at 2GHz and a dual-core 64-bit Mali-T860 graphics processor (GPU) clocked at 700MHz, while incorporating advanced technologies. Including the global full-mode (LTE) Cat.6 modem, the world's first True Bright image processor supporting high-sensitivity RWWB, MediaTek MiraVision 2.0 high-quality image display technology, and CorePilot exclusive heterogeneous scheduling algorithm, etc. Work and optimize the performance and power consumption of the central processing unit (CPU) and image processor.
Countering Qualcomm/MediaTek Marvell to sacrifice 3D SoC
In response to the fierce fire of Qualcomm and MediaTek, Marvell also blew up the counterattack horn and actively cooperated with TSMC to develop exclusive chip interconnect technology, stacking 16 and 28 nm wafers in 2.5D package, achieving the industry's first modularization, VSoC (Virtual SoC) design architecture - MoChi (Modular Chip), to create a cost-effective and functionally integrated mobile processor SoC, is expected to come out at the end of this year.
Sean Keohane, vice president of global operations at Marvell, believes that a lower cost, highly integrated design advantage will be the key to Marvell's future battle processor battlefield.
Sean Keohane, vice president of global operations at Marvell, said that the 1x nanofin-type transistor (FinFET) process is definitely the focus of current research and development for mobile processor manufacturers; however, the 16/14 nm FinFET system's single-chip (SoC) addition complexity increases. In addition, the cost is also prohibitive. The cost of masks is only $5 million. Once the design is wrong, it will be reopened. It is more difficult to meet the investment and pressure of wafer vendors. High-performance, intimate price demand with manufacturers. This has prompted the industry to subvert the traditional design framework and create SoCs with different thinking.
In fact, Qualcomm and MediaTek have recently been active, and all of them have deployed 20nm 7-mode LTE Cat. 6 processors, while Qualcomm has advanced to LTE Cat. 9 specifications. MediaTek has raised the CPU race threshold to 10 cores. Therefore, as the third force, the product specifications still stay in the eight-core, 5-mode LTE Marvell pressure. In order to defend the international brand market share and continue to explore the 4G market in mainland China, Marvell has begun to bet the next generation of 16nm FinFET process, brewing a counterattack.
Keohane stressed that in the future, processor performance, integration and cost advantages are indispensable. Marvell pre-released the VSoC architecture at this year's World Mobile Communications Conference (MWC) - MoChi, which is now a high investment, high risk and high complexity The 16nm FinFET was born. MoChi can regard the most important CPU/GPU in SoC, as well as peripheral key communication components such as LTE and Wi-Fi Combo as a module, flexible use of 16nm or 28/20nm process, and then through exclusive definition. The Interconnect interface, virtualization architecture and 2.5D packaging technology enable a new era of SoCs.
Keohane analyzes that the mobile SoC is fully integrated into the 64-bit architecture and integrates application processors, multi-band multi-mode LTE modems, and wireless area network (Wi-Fi) 802.11ac plus Bluetooth 4.1 multi-function integration (Combo) ) Wafers are the trend of the times, but as SoCs involve more technical aspects, the risk of design errors will inevitably climb. Therefore, Marvell and TSMC will fully develop MoChi, which will emulate the concept of PC processor North and South Bridge chipset, develop multi-core CPU/GPU with 16nm FinFET, pursue higher logic computing power; and build LTE with mature 28/20 nm. The data machine and Wi-Fi Combo achieve high economic efficiency and are finally packaged into SoCs through a 2.5D interposer or a 3D stack (TSV) stack.
In this way, the processor factory can not only spread the eggs to multiple baskets, but also accelerate the advanced process design process, while improving the cost performance of the product to further meet the requirements of the system factory. Keohane also revealed that due to the high demand for analog devices such as mobile device amplification power management chips (PMICs) and radio frequency chips (RF ICs), the company also plans to push the MoChi SoC architecture to analog/digital process integration in 2016. level.
Semiconductor king is unwilling to be lonely, Intel plus code pushes LTE new platform
In the second half of this year, in addition to the drama of the top three in the LTE processor market, today's semiconductor brother Intel can also join the ranks of competing, adding variables to the market situation. Intel regards the LTE data processor chip as an important weapon for sprinting the tablet and mobile phone processor in mainland China. Therefore, the latest product, XMM 7360, is also released in Computex. It is the first in the industry to achieve LTE-Advanced Cat. 10, 450 Mbit/s downlink peak The rate supports three-carrier CA, LTE Broadcast, VoLTE, and advanced functions such as LTE/Wi-Fi Interworking and Co-existence.
Vijay Krishnan, senior director of the Intel Communications Devices Group, said that mobile phones, tablets, and even the introduction of notebooks into the next generation of LTE specifications are gradually erupting, so Intel is also expanding the LTE data processor chip lineup, with application processors plus data processors. The dual-chip solution, as well as the integrated SoC, will tap into the two markets of tablets and handsets; it will also work with the development of the relevant RF transceiver, SMARTI, to accelerate the implementation of LTE Cat. 10 specifications and boost multi-antenna data transmission and up to Twenty-nine global LTE band support capabilities.
Krishnan also revealed that Intel's strategy of exploiting the mobile market footprint with LTE data machines has been effective, not only successfully rushing into the ASUS Zenfone 2 mobile phone supply chain, but also gradually opening up visibility in the mobile phone and tablet market in mainland China; and carrying its latest LTE data platform. The terminal products are also expected to be listed in the peak season at the end of the year, further boosting Intel's momentum in the mobile market.
Just like Qualcomm's strategy of joining hands with Quanzhi and MediaTek to bring together 2G/3G era public board partners, Intel also invested in the Tsinghua Unisplendour Group's approach to invest in the Group's two major chip vendors, Spreadtrum and Rideco, and also announced with Ruixin. Micro-strategic cooperation shows its active intention to build a pile in the mobile device market in mainland China.
Not only that, but Intel will further expand its reach into the Internet of Things market and publish a variety of processors in one fell swoop, extending the computing business to new areas and advancing into a fully intelligent and connected world.
Create a new experience in networking computing, Intel's next-generation processor debut
Kirk Skaugen, senior vice president and general manager of Intel's computing business group, said that looking forward, the new user experience will become the mainstream, natural user interface, biometric function without login, and wireless charging. The three major trends, such as the concept, will sweep the world, and these are inseparable from computing power. Therefore, Intel has introduced a new generation of processor lineup, which will create a new computing experience with powerful computing power.
Skaugen pointed out that Intel's True Key face recognition technology, which works with Microsoft (Windows), can identify faces and fingerprints by computer operation to log in to the device, adding more security protection to users and improving user experience. In addition, Intel Also launched WiDi and Pro WiDi, and launched wireless charging solutions with companies such as Targus and Haier, and also cooperated with members of several wireless charging alliances (A4WP), including Hon Hai Connector Group, Basecom, and ODM. The factory BYD, Primax, etc., will continue to sell related products this year to create a completely wireless computer computing experience.
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